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Special Issue on ‘Van der Waals Heterostructures and Superlattices– From Manufacture to Device Applications’


Guest Editor: Yuan Liu

Professor

Hunan University 

Email: yuanliuhnu@hnu.edu.cn



Guest Editor: Wei Kong

Assistant Professor

Westlake University

Email: kongwei@westlake.edu.cn



Guest Editor: Chen Wang

Assistant Professor

Tsinghua University

Email: chenwang0101@tsinghua.edu.cn



Introduction

Material integration strategies, such as epitaxial growth, usually involve strong chemical bonds and are typically limited to materials with strict structure matching and processing compatibility. Van der Waals integration, in which pre-fabricated building blocks are physically assembled together through weak vdW interactions, offers an alternative low-energy material-integration approach. Such a physical assembly method does not rely on one-to-one chemical bonds and does not involve direct chemical processing on existing materials; thus, it is not limited to materials that have similar lattice structures or require compatible synthetic conditions. It has therefore attracted considerable interests for integrating diverse crystals/materials with highly distinct lattice structures yet little chemical disorder at the interface.


The aim of this special theme is to provide a forum for researchers to present the state-of-the-art progress and to review the recent development, challenges and opportunities of van der Waals heterostructures, superlattices and devices. The theme has an emphasis on bottom-up synthesis, top-down assembling, characterization, simulation, as well as the recent progress in developing new device transport mechanism, new device structure, and new opto-electronic applications. 


Possible topics, within this scope, include but are not limited to:

  •    Novel Synthesis Methods for Controlled Growth of van der Waals heterostructure with various dimensions (0D, 1D, 
  •     2D, 3D) and mixed dimensions

  •    Novel transfer techniques for assembling Lateral and Vertical van der Waals heterostructures and superlattices

  •    Large scale and wafer scale integration of van der Waals heterostructures and superlattices

  •    Characterization of material interfaces and van der Waals interface

  •    Mechanical properties of van der Waals heterostructures and superlattices

  •    New designs of electronic structure, transport mechanism, and device behaviour of van der Waals heterostructures 

  •     and superlattices

  •    Spintronics and valleytronics of van der Waals heterostructures and superlattices

  •    Flexible and Stretchable device-based van der Waals heterostructures and superlattices

  •    Simulations of van der Waals heterostructure and device


Important dates

Please submit your papers in light of following important dates for the special theme:

  Submission deadline: 31 Oct. 2022

   First round of reviews: 30 Nov. 2022

   Final submission and decision:  31 Jan. 2023

   Publication:  Feb. – May 2023


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Submission portal at IJEM

https://mc04.manuscriptcentral.com/ijem-caep