Guest Editor:


Professor Bi Zhang

   Southern University of Science and Technology, China
  Email: zhangb@sustech.edu.cn

The special issue is to report the recent developments in the research area of machining of hard & brittle materials, such as semiconductors, advanced ceramics, optical glasses, and cutting tool materials.

   Topics may include the following:

．　Fundamental mechanisms in machining of hard & brittle materials;

．　Molecular dynamics involved in machining of hard & brittle materials;

．　Multiscale modelling and analysis for machining of hard & brittle materials;

．　Hybrid machining processes for hard & brittle materials;

．　High-speed machining of hard & brittle materials;

．　Ductile-brittle and brittle-ductile transitions involved in machining of hard & brittle materials;

．　Laser-assisted machining of hard & brittle materials;

．　Ultrasonic machining of hard & brittle materials;

．　Machining damage detection for hard & brittle materials;

．　In-process measurement and sensing of workpiece accuracies in machining of hard & brittle materials;

．　Design of machining equipment for hard & brittle materials;

．　Case studies for successful machining of hard & brittle materials.

   Notes for prospective authors:

Submitted papers should not have been previously published nor be currently under consideration for publication elsewhere.

   Important dates:

   Submission deadline: March 31, 2020

   First round of reviews: April 30, 2020

   Final submission and decision: May 31, 2020

   Publication: June-July 2020

   Submission portal at International Journal of Extreme Manufacturing: https://mc04.manuscriptcentral.com/ijem-caep

   About the journal: https://iopscience.iop.org/journal/2631-7990/page/about