International Journal of Extreme Manufacturing

Special Issue on ‘Multiscale Manufacturing towards Flexible Hybrid Electronics’

Guest Editor:

Professor YongAn Huang

Huazhong University of Science and Technology, China

Flexible hybrid electronics integrate functional materials/components in traditional and unusual electronic architectures on flexible/stretchable/curved substrates to yield systems that have unique properties, unavailable to conventional, wafer-based devices, e.g. flexible display, smart sensing skins for aircrafts and robots, epidermal electronics for healthcare and human-machine interaction, and so on. This new type of electronics devices represents a burgeoning technology that offers the electrical functions of conventional, rigid wafer-based microelectronics but with the ability to be stretched, compressed, twisted, bent, and conformed onto arbitrary shapes. It is believed that much more effort should be drawn to bring about new strategies to overcome the limitation of concurrent 2D planar photolithography. Therefore, groundbreaking multiscale manufacturing technologies are highly demanded for flexible/stretchable/curved electronics.

The aim of this special theme is to provide a forum for researchers and practitioners to present and review the state-of-the-art development, premier challenges and foresight visions in multiscale manufacturing towards flexible hybrid electronics, with an emphasis on scaling effects, new processes, new tools and new applications. Multiscale manufacturing with ultrahigh resolution, large area, and complex surface are preferred.

Possible topics, within this scope, include but are not limited to: