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Special Issue on ‘Advanced Manufacturing of Materials and Devices for Soft Electronics’


Guest Editor: Huanyu Cheng, James L. Henderson, Jr. Memorial Associate Professor

The Pennsylvania State University

Email: huanyu.cheng@psu.edu


Guest Editor: Prof. Yongfeng Mei, Professor

Fudan University

Email: yfm@fudan.edu.cn



Guest Editor: Xinge Yu, Associate Professor

City University of Hong Kong

Email: xingeyu@cityu.edu.hk


Introduction

As an emerging topic, soft electronics integrate functional materials and advanced manufacturing approaches to provide intelligent sensing devices in a flexible or even stretchable format for unmatched applications. The great potential of soft electronics has been highlighted in several representative fields, from healthcare monitoring and human-machine interface to robotics and entertainment. The development of smart materials and devices in a thin soft platform, key for soft electronics, hinges on advanced fabrication and manufacturing technologies, which also allow for high throughput and high yield in a robust way.

The aim of this special issue is to collect the unconventional and novel manufacturing technologies for developing soft electronics. The researchers and general audiences will be provided with comprehensive information on the state-of-the-art developments, challenges, and outlooks in advanced manufacturing technologies for soft electronics.


Possible topics, within this scope, include but are not limited to:

  •    Micro and nano fabrication of flexible/stretchable/curved electronics

  •    Spinning and textile electronics related processing technologies

  •    High throughput or high-efficiency femtosecond laser processing

  •    Transferring printing for flexible/stretchable/curved electronics

  •    Solution and vapour deposition based organic electronics

  •    Strain engineering of nanomembrane based electronics

  •    Processing of super-stretchable functional materials

  •    Nano/micro imprinting for flexible/stretchable/curved electronics

  •    3D printing/additive manufacturing of 3D soft electronics/bioelectronics


Important dates

Please submit your papers in light of the following important dates for the special issue:

  Submission deadline: 31 January 2023

  First round of reviews: 01 March 2023

  Final submission and decision:  30 April 2023

  Publication:  June - September 2023


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Submission portal at International Journal of Extreme Manufacturing:

https://mc04.manuscriptcentral.com/ijem-caep