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Home
About IJEM
About Journal
Aims & Scope
Editorial Board
News
Contact Us
Articles
Current Issue
All Issues
Collections
Most Cited
Most Read
Publish
Author Guidelines
Reviewers Guidelines
Submission
Call for Papers
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Rolling 2D sheets into monolithic 3D neural interfaces
In Sik Min
,
Dongjun Cho
,
Ki Jun Yu
DOI:
10.1088/2631-7990/ae4c2f
In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics
Hyunjin Jung
,
Sungjun Yoon
,
Donghee Son
DOI:
10.1088/2631-7990/ae5138
Material strategy for strain-invariant radio-frequency electronics
Senhao Zhang
,
Furong Yang
,
Chaoyun Song
,
Huanyu Cheng
DOI:
10.1088/2631-7990/ae569e
Stretchable neuromorphic electronics for future human-integrated intelligence
Tianda Fu
,
Ruizhe Yang
,
Max Weires
,
Junyi Yin
,
Yifan Liao
,
Yifan Guo
DOI:
10.1088/2631-7990/ae5004
Multi-dimensional additive manufacturing for self-driven soft actuators: a materials perspective
Soo Young Cho
,
Youngjae Yoo
,
Sae Byeok Jo
,
Jeong Ho Cho
DOI:
10.1088/2631-7990/ae536a
Emerging 2D ferroelectric materials for neuromorphic computing: progress, challenges, and opportunities
Yue Gong
,
Shuyu Fan
,
Xuechao Xing
,
Xingli Wang
,
Tay Beng Kang
DOI:
10.1088/2631-7990/ae51d1
Multi-material processing of metallic components by direct additive manufacturing methods: technologies, scientific insights, and industrial applications
Reza Ghanavati
,
Mohammad Hossein Mosallanejad
,
Amir Behjat
,
Mohammad Taghian
,
Paolo Fino
,
Luca Iuliano
,
Abdollah Saboori
DOI:
10.1088/2631-7990/ae5295
Machine learning-assisted process-structure-property correlation in laser metal additive manufacturing: a critical review
Miao Yu
,
Lida Zhu
,
Zhichao Yang
,
Jinsheng Ning
,
Pengsheng Xue
,
Shuhao Wang
,
Lu Wang
,
Xipeng Tan
DOI:
10.1088/2631-7990/ae5297
Flexible, biocompatible, and biodegradable memristive materials and devices for neuromorphic computing
Kiran A Nirmal
,
Amitkumar R Patil
,
Pradnya P Patil
,
Atul C Khot
,
Tukaram D Dongale
,
Tae Geun Kim
DOI:
10.1088/2631-7990/ae542d
Atomic layer processing for Ångström-scale precision in 3D-integrated semiconductor manufacturing
Hae Lin Yang
,
Min Chan Kim
,
Gi-Beom Park
,
Ji-Yeon Park
,
Hyein Park
,
Jihoon Shin
,
Jinho Ahn
,
Jin-Seong Park
DOI:
10.1088/2631-7990/ae536b
Interpretable machine learning integrated with physicochemical feature for developing additively manufactured ultra-high strength and ductility steel
Yating Luo
,
Tao Zhu
,
Cunliang Pan
,
Xu Ben
,
Xudong An
,
Xiaoming Wang
,
Hongmei Zhu
DOI:
10.1088/2631-7990/ae5006
Metallic reaction driven manufacturing of concrete type alloy
Weicheng Kong
,
Ximin Yuan
,
Yuling Lu
,
Nian Liu
,
Tao Fu
,
Yong He
DOI:
10.1088/2631-7990/ae5137
Synergistic performance enhancement of additively manufactured copper-nickel dissimilar alloy components via a novel quasi in situ cryogenic treatment
Tianxing Chang
,
Minghua Ma
,
Huwei Zhang
,
Xuewei Fang
,
Ke Huang
DOI:
10.1088/2631-7990/ae557d
Microassembly of multi-material and 3D integration enabled by programmable and universal high-precision micro-transfer printing
Qinhua Guo
,
Lizhou Yang
,
Yawen Gan
,
Jingyang Zhang
,
Jiajun Zhang
,
Jiahao Jiang
,
Weihan Lin
,
Kaiqi Chen
,
Chenchen Zhang
,
Yunda Wang
DOI:
10.1088/2631-7990/ae4f3d
Machine learning assisted laser powder bed fusion process optimization of CM247LC: crack mitigation and strength-ductility enhancement
Pengfei Hu
,
Zhuangzhuang Liu
,
Qihang Zhou
,
Zhengyu Wei
,
Xiaohong Qi
,
Jianxin Xie
DOI:
10.1088/2631-7990/ae542e
Laser-induced hierarchical micro/nanostructures on flexible CNT-silicone film for synergistic passive/active anti/de-icing in extremely low-temperature environments
Xiaoming Feng
,
Zhizhong Wang
,
Linlin Wei
,
Bo Li
,
Guizhong Tian
,
Xiaohui Zhu
,
Lei Zhao
,
Xiangyi Meng
,
Shichao Niu
,
Zhiwu Han
,
Luquan Ren
DOI:
10.1088/2631-7990/ae4e8f
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